HSB18-232310

Reference Only

HSB18-232310

heat sink, BGA, 23 x 23 x 10 mm

Category:
Thermal Management
Sub Category:
Fans & Blowers
Same Sky (formerly CUI Devices)

Product Description

heat sink, BGA, 23 x 23 x 10 mm

Product Tags

Technical Specifications

Attribute Description
Dimensions LxWxH (in) 0.91 x 0.91 x 0.39
Dimensions LxWxH (mm) 23 x 23 x 10
Heat Sink Type BGA
Height (mm) Extruded
Length (mm) 10
Material 23
Material Finish AL6063-T5
Mounting Style Black Anodized
Package Cooled Adhesive
Power Dissipation @ 75°C ΔT Not Applicable
nat conv (W) 3.67
Solder Pin Orientation No Pin
Thermal Resistance @ 1 W 23
200 LFM (°C/W) 4.7
400 LFM (°C/W) 20.41
This is a staging environment

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