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HSB19-272718
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HSB19-272718
heat sink, BGA, 27 x 27 x 18 mm
Product Description
heat sink, BGA, 27 x 27 x 18 mm
Technical Specifications
| Attribute | Description |
|---|---|
| Dimensions LxWxH (in) | 1.06 x 1.06 x 0.71 |
| Dimensions LxWxH (mm) | 27 x 27 x 18 |
| Heat Sink Type | BGA |
| Height (mm) | Extruded |
| Length (mm) | 18 |
| Material | 27 |
| Material Finish | AL6063-T5 |
| Mounting Style | Black Anodized |
| Package Cooled | Adhesive |
| Power Dissipation @ 75°C ΔT | Not Applicable |
| nat conv (W) | 6.75 |
| Solder Pin Orientation | No Pin |
| Thermal Resistance @ 1 W | 27 |
| 200 LFM (°C/W) | 3.3 |
| 400 LFM (°C/W) | 11.11 |