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HSB35-272725
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HSB35-272725
heat sink, BGA, 27 x 27 x 25 mm
Product Description
heat sink, BGA, 27 x 27 x 25 mm
Technical Specifications
| Attribute | Description |
|---|---|
| Dimensions LxWxH (in) | 1.06 x 1.06 x 0.984 |
| Dimensions LxWxH (mm) | 27 x 27 x 25 |
| Heat Sink Type | BGA |
| Height (mm) | Extruded |
| Length (mm) | 25 |
| Material | 27 |
| Material Finish | AL6063-T5 |
| Mounting Style | Black Anodized |
| Package Cooled | PCB |
| Power Dissipation @ 75°C ΔT | Not Applicable |
| nat conv (W) | 8.59 |
| Solder Pin Orientation | No Pin |
| Thermal Pad | No |
| Thermal Resistance @ 1 W | 27 |
| 200 LFM (°C/W) | 1.9 |
| 400 LFM (°C/W) | 8.74 |